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Digg It - Basics of Manufacturing Printed Circuit Boards
In electronics, printed circuit boards, or PCBs, are used to mechanically support electronic components which have their connection leads soldered onto copper pads in surface mount applications or through rilled holes in the board and copper pads for soldering the component leads in thru-hole applications. A board design may have all thru-hole components on
According to USFDA, a combination product is one composed of any combination of a drug and device; biological product and device; drug and biological product
the top or component side, a mix of thru-hole and surface mount on the top side only, a mix of thru-hole and surface mount components on the top side and surface mount components on the bottom or circuit side, or surface mount components on the top and bottom sides of the board.
The boards are also used to electrically connect the required leads for each co
The boards are also used to electrically connect the required leads for each co
; or drug, device, and biological product and fixed dose combination would include two or more combinations of drug.
Examples of combination products may in
Examples of combination products may in
ponent using conductive copper traces. The component pads and connection traces are etched from copper sheets laminated onto a non-conductive substrate. Printed circuit boards are designed as single sided with copper pads and traces on one side of the board only, double sided with copper pads and traces on the top and bottom sides of the board, or multilayer
lude drug-coated devices, drugs packaged with delivery devices in medical kits, and drugs and devices packaged separately but intended to be used together.
designs with copper pads and traces on top and bottom of board with a variable number of internal copper layers with traces and connections.
Single or double sided boards consist of a core dielectric material, such as FR-4 epoxy fiberglass, with copper plating on one or both sides. This copper plating is etched away to form the actual copper pads and conne
Single or double sided boards consist of a core dielectric material, such as FR-4 epoxy fiberglass, with copper plating on one or both sides. This copper plating is etched away to form the actual copper pads and conne
here is enormous increase in the number of combination products entering the market in the recent years. Combination products have proven advantages but fixe
tion traces on the board surfaces as part of the board manufacturing process. A multilayer board consists of a number of layers of dielectric material that has been impregnated with adhesives, and these layers are used to separate the layers of copper plating. All of these layers are aligned and then bonded into a single board structure under heat and pressu
d dose combinations are still in the process of convincing regulatory authority on their advantages over the single ingredient formulations.
Combination pro
Combination pro
re. Multilayer boards with 48 or more layers can be produced with today's technologies.
In a typical four layer board design, the internal layers are often used to provide power and ground connections, such as a +5V plane layer and a Ground plane layer as the two internal layers, with all other circuit and component connections made on the top and bottom la
In a typical four layer board design, the internal layers are often used to provide power and ground connections, such as a +5V plane layer and a Ground plane layer as the two internal layers, with all other circuit and component connections made on the top and bottom la
ucts have become life saving products for the pharmaceutical companies who doesn’t have many innovative molecules in their product pipeline and have been inc
ers of the board. Very complex board designs may have a large number of layers to make the various connections for different voltage levels, ground connections, or for connecting the many leads on ball grid array devices and other large integrated circuit package formats.
There are usually two types of material used to construct a multilayer board. Pre-preg
There are usually two types of material used to construct a multilayer board. Pre-preg
easingly used in the product life cycle management. Even the companies having product patents are trying to extend their product life cycle through the combi
material is thin layers of fiberglass pre-impregnated with an adhesive, and is in sheet form, usually about .002 inches thick. Core material is similar to a very thin double sided board in that it has a dielectric material, such as epoxy fiberglass, with a copper layer deposited on each side, usually .030 thickness dielectric material with 1 ounce copper la
nation products and maximize the revenues. But the companies involved in this practice are overlooking that they are burdening the patients both economically
er on each side. In a multilayer board design, there are two methods used to build up the desired number of layers. The core stack-up method, which is an older technology, uses a center layer of pre-preg material with a layer of core material above and another layer of core material below. This combination of one pre-preg layer and two core layers would make
and physically. They need to rightly judge the benefits of the combination products and they have to even look at the risks involved when combining the produ
a 4 layer board.
The film stack-up method, a newer technology, would have core material as the center layer followed by layers of pre-preg and copper material built up above and below to form the final number of layers required by the board design, sort of like Dagwood building a sandwich. This method allows the manufacturer flexibility in how the board la
The film stack-up method, a newer technology, would have core material as the center layer followed by layers of pre-preg and copper material built up above and below to form the final number of layers required by the board design, sort of like Dagwood building a sandwich. This method allows the manufacturer flexibility in how the board la
ts. Some of the combination products were well accepted by physicians while others suffered. Companies involved in development of combination products are fi
er thicknesses are combined to meet the finished product thickness requirements by varying the number of sheets of pre-preg in each layer. Once the material layers are completed, the entire stack is subjected to heat and pressure that causes the adhesive in the pre-preg to bond the core and pre-preg layers together into a single entity.
The process of manuf
The process of manuf
ding difficulty in defining their combination products and facing various challenges from selecting a combination to marketing it.
Following aspects would a
Following aspects would a
cturing printed circuit boards follows the steps below for most applications:
Basic Steps for Manufacturing Printed Circuit Boards:
1. Setup - the process of determining materials, processes, and requirements to meet the customer's specifications for the board design based on the Gerber file information provided with the purchase order.
2. Imaging - the p
Basic Steps for Manufacturing Printed Circuit Boards:
1. Setup - the process of determining materials, processes, and requirements to meet the customer's specifications for the board design based on the Gerber file information provided with the purchase order.
2. Imaging - the p
dd to the challenges in developing combination products:
Which markets to tap where the combination products can do fairly well?
Which combination prod
Which markets to tap where the combination products can do fairly well?
Which combination prod
rocess of transferring the Gerber file data for a layer onto an etch resist film that is placed on the conductive copper layer.
3. Etching - the traditional process of exposing the copper and other areas unprotected by the etch resist film to a chemical that removes the unprotected copper, leaving the protected copper pads and traces in place; newer process
3. Etching - the traditional process of exposing the copper and other areas unprotected by the etch resist film to a chemical that removes the unprotected copper, leaving the protected copper pads and traces in place; newer process
cts are meaningful and rational?
Which therapeutic categories to select?
Which Combinations can address unmet needs of the patients?
Do combin
Which therapeutic categories to select?
Which Combinations can address unmet needs of the patients?
Do combin
s use plasma/laser etching instead of chemicals to remove the copper material, allowing finer line definitions.
4. Multilayer Pressing - the process of aligning the conductive copper and insulating dielectric layers and pressing them under heat to activate the adhesive in the dielectric layers to form a solid board material.
5. Drilling - the process of dr
4. Multilayer Pressing - the process of aligning the conductive copper and insulating dielectric layers and pressing them under heat to activate the adhesive in the dielectric layers to form a solid board material.
5. Drilling - the process of dr
tions increase the patient compliance?
What would be the developing cost?
How to tackle the risks encountered during combination product developmen
What would be the developing cost?
How to tackle the risks encountered during combination product developmen
illing all of the holes for plated through applications; a second drilling process is used for holes that are not to be plated through. Information on hole location and size is contained in the drill drawing file.
6. Plating - the process of applying copper plating to the pads, traces, and drilled through holes that are to be plated through; boards are plac
6. Plating - the process of applying copper plating to the pads, traces, and drilled through holes that are to be plated through; boards are plac
t?
As combination products don't fit into the traditional categories of drugs, medical devices, or biological products, the USFDA is in the process of devel
As combination products don't fit into the traditional categories of drugs, medical devices, or biological products, the USFDA is in the process of devel
d in an electrically charged bath of copper.
7. Second Drilling - this is required when holes are to be drilled through a copper area but the hole is not to be plated through. Avoid this process if possible because it adds cost to the finished board.
8. Masking - the process of applying a protective masking material, a solder mask, over the bare copper tra
7. Second Drilling - this is required when holes are to be drilled through a copper area but the hole is not to be plated through. Avoid this process if possible because it adds cost to the finished board.
8. Masking - the process of applying a protective masking material, a solder mask, over the bare copper tra
ping new procedures for reviewing their safety, efficacy and quality.
Professional from academic institutions, pharmaceutical industries, health care indust
Professional from academic institutions, pharmaceutical industries, health care indust
ces or over the copper that has had a thin layer of solder applied; the solder mask protects against environmental damage, provides insulation, protects against solder shorts, and protects traces that run between pads.
9. Finishing - the process of coating the pad areas with a thin layer of solder to prepare the board for the eventual wave soldering or refl
9. Finishing - the process of coating the pad areas with a thin layer of solder to prepare the board for the eventual wave soldering or refl
y and representatives from various regulatory agencies are working out to design the regulatory requirements for manufacture and sale of combination products
w soldering process that will occur at a later date after the components have been placed.
10. Silk Screening - the process of applying the markings for component designations and component outlines to the board. May be applied to just the top side or to both sides if components are mounted on both top and bottom sides.
11. Routing - the process of separat
10. Silk Screening - the process of applying the markings for component designations and component outlines to the board. May be applied to just the top side or to both sides if components are mounted on both top and bottom sides.
11. Routing - the process of separat
.
As there is an increasing trend of the combination products companies manufacturing such products should be able to tackle the problems involved in the de
As there is an increasing trend of the combination products companies manufacturing such products should be able to tackle the problems involved in the de
ing multiple boards from a panel of identical boards; this process also allows cutting notches or slots into the board if required.
12. Quality Control - a visual inspection of the boards; also can be the process of inspecting wall quality for plated through holes in multilayer boards by cross-sectioning or other methods.
13. Electrical Testing - the proce
12. Quality Control - a visual inspection of the boards; also can be the process of inspecting wall quality for plated through holes in multilayer boards by cross-sectioning or other methods.
13. Electrical Testing - the proce
elopment. They need to be wiser in analyzing the market trends and the regulatory requirements.
Companies that provide selfless information through particip
Companies that provide selfless information through particip
s of checking for continuity or shorted connections on the boards by means applying a voltage between various points on the board and determining if a current flow occurs. Depending upon the board complexity, this process may require a specially designed test fixture and test program to integrate with the electrical test system used by the board manufacturer
tion in industry events and feedback to regulatory authorities would be able to face the challenges and will be successful in developing combination products
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